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2 Layer HASL Lead Free Board
4 Layer ENIG Board , Immersion Gold
Heavy Copper ENIG Board
4 Layer Blue Mask Board
BGA Type,4 Layer ENIG Board
2 Layer OSP PCB
TG150 16 Layer Board
Half Hole ENIG Board1.5u
COB Board
High Thermal Conductivity ENGI Al Base
TG170 Heavy Copper BGA ENIG Board
Blue mask Gold Finger
3/2/2/3Oz Heavy Copper HASL Board
HASL AL base Board
2 Layer ENIG Keypad board
2 Layer Remote ENIG Keypad Board
2 Layer ENIG Board
6 Layer ENIG Board

6 Layer Rigid Flex Board

Laminate: FR4+PI

Thickness:1.6mm

(Min Trace Width/Space:

0.1mm /0.1mm

Inner Layer:0.1mm/0.1mm)

Min Hole Diameter:0.2mm

Surface Treatment: Immersion Tin

6 Layer Mix pressure Inset Board

Laminate: FR4+R04350B

Thickness:1.6mm

(Min Trace Width/Space:

0.15m m/0.15mm

Inner Layer:0.15mm/0.15mm)

Min Hole Diameter:0.25mm

Surface Treatment: ENIG

Rigid-flex multi Layer pcb

Layers Count:10Layer

Copper:1oz

Layers Count:4Layers

Thickness:3.0mm

Copper:28oz

14 Layer Hard copper

Laminate: FR4+TG170

Thickness: 3.5mm

Min Hole Diameter:0.5mm

Surface Treatment: ENIG

Hesvy Copper Power module pcb

Layers Count:10Layer

Thickness:3.0mm

Copper:3oz

Laminate: Al base + PTFE

Thickness: 3.2mm

Surface Treatment: ENIG, Anodized

Note:Deep tolerance: +/-0.025mm

  • COMMUNICATION
  • INDUSTRY CONTROL
  • COMPUTRE
  • AUTOMOBILE
  • MEDICAL CARE
  • AERONAUTIC

User:Main Board

Material:FR-4

Layer:10

Board Thickness:2.0mm

Copper Thickness:1oz

Min Space/Track:3/3mil

Surface Finished:ENIG

User:Communication Station

Material:FR-4

Layer:8

Board Thickness:1.6mm

Copper Thickness:1.6mm

Thickness:1oz

Min Space/Track:3/3mil

Surface Finished:ENIG

User:Intercom

Material:FR-4

Layer:2

Board Thickness:0.8mm

Copper Thickness:1oz

Min Space/Track:4/4mil

Surface Finished:Electronic Gold

User:Control Main Board

Material:FR-4

Layer:8

Board Thickness:1.6mm

Copper Thickness:1oz

Presure Construction: Buired and Blind Hole

Min Space/Track:3/3mil

Min Hole Size:0.2mm

Surface Finished:ENIG+Flash Gold

User:Control Main Board

Material:FR-4 Layer:8

Board Thickness:1.6mm

Copper Thickness:1oz

Min Space/Track:3/3mil

User:Industry Control

Material:FR-4

Layer:6

Board Thickness:1.6mm

Copper Thickness:1oz

Min Space/Track:3/3mil

Min Hole Size:0.2mm

Surface Finished:Immersion Ni PD Gold

User:Power Supplier

Material:FR-4 TG170

Layer:6

Board Thickness:1.6mm

Copper Thickness:4oz

Min Space/Track: 8/8 mil

Min Hole Size:0.4mm

Surface Finished:HAL

User:Power Supplier

Material:FR-4

Layer:4

Board Thickness:1.6mm

Copper Thiness:3oz

Min Space/Track:8/8 mil

Min Hole Size:0.4mm

Surface Finished:HAL

User:PC

Material:FR-4+PI(TaiFlex)

Layer:4

Board Thickness:1.6mm + 0.15mm

Copper Thickness:0.5oz

Min Space/Track: 3/3mil

Surface Finished:ENIG

User:PC

Material:FR-4

Layer:4

Board Thickness:1.6mm

Copper Thickness:5oz

Min Space/Track:4/4 mil

Surface Finished:ENIG+Gold Finger

User:PC

Material:FR-4

Layer:6

Board Thickness:1.6mm

Copper Thickness:1 oz

Min Space/Track:3/3 mil

Surface Finished:ENIG+Gold Finger

User:Autocar

Material:FR-4

Thickness:1.6mm

Copper Thickness:1 oz

Impedance Control:100 ohm+/-10%

Min Space/Track:4/4 mil

Min Hole Size:0.2mm

Min PTH:25 um

Surface Finished:LFHASL

User:Automobil

Material:FR-4 TG170

Thickness:4.0 mm

Copper Thickness:2oz

Min PTH:25um

Surface Finished:LFHASL

Autocar

Material:FR-4

Thickness:1.6mm

Copper Thickness:1oz

Min Space/Track:4/4mil

Min Hole Size:0.2mm

Min PTH:25um

Surface Finished:LFHASL

User:Medical connecter

Material:FR-4 TG170

Thickness:2.0mm

Copper Thickness:1oz

Hole Type:Counterbore

PTH:30 UM+5/-0 UM

Soldermask:Black

Surface Finished:ENIG

User:Medical Care

Material:FR-4 FR -4 + PI(DUPONT)

Layer:2

Board Thickness:0.4mm

Copper Thickness:5oz

Min Space/Track:3/3 mil

Surface Finished:ENIG

User:Medical Care

Material:FR-4 FR -4 + PI(DUPONT)

Layer:6

Thickness:1.6mm

Copper Thickness:0.5oz

Min Space/Track3/3mil

Surface Finished:ENIG

User:Medical Care

Material:FR-4 FR -4 + PI(Doosan)

Layer:6

Thickness:1.2mm+0.15mm

Copper Thickness0.5oz

Min Space/Track:3/3mil

Surface Finished:ENIG

User:Medical Care

Material:FR-4 FR -4 + PI(Taiflex)

Layer:4

Contruction :1+2+1

Thickness :1.6mm+0.15mm

Copper Thickness:0.5oz

Min Space/Track:3/3mil

Surface Finished:ENIG

User:Airplane

Material:FR-4

Thickness:1.6mm

Copper Thickness:1oz

Min Space/Track:4/4mil

Min Hole Size:0.2mm

Min PTH:25um

Surface Finished:LFHASL

The board quantity:
Board layers:
Material type:
Board Thickness
Finished copper thickness:
Surface finishes:
Upload Files(ZIP,RAR):
Delivery:
Country:
     pcs    set
   
      0.6       0.8       1.0       1.2       1.5       2.0       2.4       3.0       4.0
      0.5oz       1oz       1.5oz       2oz       3oz       4oz
      HASL       LF-HASL       OSP(ENTEK)       Immersion Tin       Immersion Gold       Immersion Silver

* Please upload the board files (GERBER) and other documentation.

    working days(This is only production time, shipping time takes about 1~3 days.)
    Tips: Please carefully check the above information, so that we can give you an accurate quote.
    Reviews ...
     
     
    • 9/15/2015 5:19:45 PM PST 0

      PCB BOARD TG130 (thickness):FR4-1.6MM 2 Layer BLACK HASL

      TG130

      (thickness):FR4-1.5MM 2 Layer

      Dark Green

      HASL

      Finished copper thickness: 1.0 oz

      Board size 115.5*89mm (1*2)

      quantity :1000PCS

      0
    • 9/15/2015 5:19:45 PM PST 0

      PCB BOARD TG130 (thickness):FR4-1.5MM 2 Layer Dark Green HASL

      TG130

      (thickness):FR4-1.6MM 2 Layer

      Dark Green

      HASL

      Finished copper thickness: 1 /1oz

      Board size 193.1*177.7mm (2*3)

      quantity :2000PCS

      0
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