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CY62167DV30LL-55ZXI IC SRAM 16MBIT PARALLEL 48TSOP I
  • CY62167DV30LL-55ZXI
  • CY62167DV30LL-55ZXI
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CY62167DV30LL-55ZXI

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Description

IC SRAM 16MBIT PARALLEL 48TSOP I

Not found, similar datasheet recommended

  • ECAD Module
  • Memory Size: 16Mbit
  • Brand: Flip Electronics
  • DateCode: 12+13+
  • Package / Case: TSOP48
  • Organisation: 1M words x 16 bit
  • Number of Words: 1M
  • Number of Bits per Word: 16bit
  • Maximum Random Access Time: 55ns
  • Address Bus Width: 20bit
  • Low Power: Yes
  • Timing Type: Asynchronous
  • Mounting Type: Surface Mount
  • Package Type: TSOP
  • Pin Count: 48
  • Dimensions: 12 x 18.4 x 1.05mm
  • Height: 1.05mm
  • Length: 12mm
  • Maximum Operating Supply Voltage: 3.6 V
  • Maximum Operating Temperature: +85 °C
  • Width: 18.4mm
  • Minimum Operating Temperature: -40 °C
  • Minimum Operating Supply Voltage: 2.2 V

All product names, trademarks, brands and logos used on this site are the property of their respective owners. The depiction, description or sale of products featuring these names, trademarks, brands and logos is for identification purposes only and is not intended to indicate any affiliation with or authorization by any rights holder.

Product Attributes

  • Description: The CY62167DV30LL-55ZXI is a high-performance, low-power, non-volatile, static RAM (SRAM) device. Features: - 32K x 8 bit organization - Single 5V power supply - Fast access time: 55ns - Low power consumption: Active: 20 mA (max) Standby: 1 μA (max) - Low standby current: 1 μA (max) - TTL compatible inputs and outputs - Automatic power-down when deselected - TTL compatible chip enable and output enable - Automatic power-up - Package: TSOP48, Flip Electronics Application: The CY62167DV30LL-55ZXI is suitable for use in applications such as memory expansion, data buffering, and cache memory. It is also suitable for use in embedded systems, industrial automation, and consumer electronics. (For reference only)

Features

TSOP l Configurable as 1M x 16 or as 2M x 8 SRAM

Very high speed: 45 ns

Wide voltage range: 2.2V - 3.6V

Ultra-low active power

Typical active current: 2 mA @ f = 1 MHz

Typical active current: 18.5 mA @ f = fMax(45 ns speed)

Ultra-low standby power

Easy memory expansion with CE1,CE2 and OE features

Automatic power-down when deselected

CMOS for optimum speed/power

Available in Pb-free and non Pb-free 48-ball VFBGA and 48-pin TSOPI package

 

Functional Description

The CY62167DV30 is a high-performance CMOS static RAM organized as 1M words by`16 bits. This device features advanced circuit design to provide ultra-low active current. This is ideal for providing More Battery LifeTM (MoBL) in portable applications such as cellular telephones.The device also has an automatic power-down feature that significantly reduces power consumption by 99% when addresses are not toggling. The device can also be put into standby mode when deselected(CE1 HIGH or CE2 LOW or both BHE and BLE are HIGH). The input/output pins(I/O0 through I/O15) are placed in a high-impedance state when: deselected (CE1 HIGH or CE2 LOW), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE,BLE HIGH), or during a Write operation (CE1 LOW, CE2 HIGH and WE LOW).

Writing to the device is accomplished by taking Chip Enables(CE1 LOW and CE2 HIGH) and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O8 through l/O15) is written into the location specified on the address pins (A0 through A19).

Reading from the device is accomplished by taking Chip Enables (CE1, LOW and CE2 HIGH) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is Low, then data from the memory location specified by the address pins will appear on l/O0 to l/O7. If Byte High Enable (BHE) is Low, then data from memory will appear on I/O8 to I/O15. See the truth table at the back of this data sheet for a complete description of Read and Write modes.


Preview of the first 3 pages of the data sheet

  • CY62167DV30LL-55ZXI's pdf picture 1
  • CY62167DV30LL-55ZXI's pdf picture 2
  • CY62167DV30LL-55ZXI's pdf picture 3
QUANTITY UNIT PRICE PLUS UNIT PRICE TOTAL PRICE
≥1: US $6.98500 US $6.28650 US $6.28650
≥5: US $6.63575 US $6.28650 US $31.43250
≥10: US $6.28650 US $6.28650 US $62.86500
≥20: US $6.11188 US $6.28650 US $125.73000
≥50: US $5.93725 US $6.28650 US $314.32500
≥100: US $5.76262 US $6.28650 US $628.65000
≥200: US $5.58800 US $6.28650 US $1257.30000
≥500: US $5.51815 US $6.28650 US $3143.25000
≥1000: US $5.41338 US $6.28650 US $6286.50000
The parameters and performance indicators of this product are sourced from the internet. In case of discrepancies, please refer to the manufacturer's technical specifications!!

Substitute Product

Substitute Product Description
AS6C1616-55SIN 2Mb (128K x 16) Parallel CMOS SRAM, 55ns, 3.0V-3.6V, Industrial Temperature Grade.
IS62WV12816BLL-55TLI 2Mb (128K x 16) CMOS SRAM, 55ns, 2.5V~3.6V, Industrial Temperature Range.
K6R1016C1C-UI55 2Mb (128K x 16) CMOS SRAM, 55ns, 3.3V, Industrial Temperature Range.
W25X16VSSIG 16Mb (2MB x 8) Serial Flash Memory, 55ns, 3.3V, Industrial Temperature Range.
IS61WV25616BLL-55TLI 4Mb (256K x 16) CMOS SRAM, 55ns, 2.5V~3.6V, Industrial Temperature Range.
AS6C8016A-55TIN 8Mb (512K x 16) CMOS SRAM, 55ns, 3.0V-3.6V, Industrial Temperature Grade.
CY7C1041DN-55ZXI 4Mb (256K x 16) Static RAM, 55ns, 3.0V-3.6V, Industrial Temperature.
HY628400ALG-55C 4Mb (512K x 8) Low Power SRAM, 55ns, 2.7V-3.6V, Commercial Temperature Range.
GS81316D18E-200I 18Mb SyncBISRAM?, 200MHz, 3.3V, 200 Pin TQFP, Industrial Temperature Range.
IS61LF25636A-6.5TQI 256k x 36 bit Synchronous SRAM, 6.5ns, 3.3V, 100-Pin STQFP, Industrial Temperature Grade.

Feel free to click on the product names to view more details and specifications on the respective substitute products.

Product Usage

The CY62167DV30LL-55ZXI is a high-performance, low-power static RAM (SRAM) chip manufactured by Cypress Semiconductor. It is a 1M x 16 bit SRAM, implying it has a total storage capacity of 16 Megabits (2 Megabytes). It operates with a voltage range of 2.2V to 3.6V and features a 55 ns access time.

This SRAM chip is widely used in various types of circuits and applications that require fast and reliable memory storage. Here are some common application areas where the CY62167DV30LL-55ZXI might be used:

  1. Embedded Systems: In microcontroller-based systems where fast and low-power memory is essential for storing data, instructions, and processing information.

  2. Networking Equipment: Routers, switches, and other networking hardware often use SRAM for buffering and temporary data storage.

  3. Telecommunications: Base stations, modems, and other telecommunications devices that need rapid access to large amounts of data.

  4. Consumer Electronics: Devices such as digital cameras, handheld devices, and gaming consoles where fast and efficient temporary data storage is required.

  5. Industrial Control Systems: For logging data, temporary storage, and buffering in various industrial applications, including automation and process control systems.

  6. Aerospace and Defense: Critical applications where reliability and quick access to data are vital, such as in avionics and defense systems.

  7. Medical Devices: For storing patient data, temporary data logging, and quick retrieval of information in various types of diagnostic and monitoring equipment.

  8. Automotive Systems: In modern cars, SRAM can be used in infotainment systems, advanced driver-assistance systems (ADAS), and other electronic control units (ECUs).

  9. Instrumentation: Used in oscilloscopes, signal analyzers, and other test measurement equipment for data buffering and signal processing.

  10. Computing and Storage Devices: Although DRAM is more commonly used in mainstream computing, certain specialized computing devices and storage systems may leverage SRAM for cache memory due to its speed advantages.

Designers choose the CY62167DV30LL-55ZXI when low power consumption, high speed, and reliability are critical factors. It features a straightforward interface with common SRAM-like read and write operations, making it versatile across many applications.

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