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Label Inspection

Description:

Label inspection is a comparative analysis based on the label images, the original labels and official website information, etc. provided by the customer so as to identify their authenticity.

Our Strengths: We possess a vast database of original labels, allowing for quick and accurate comparisons with genuine labels.

Notes:

1. The conclusion of the label inspection is for illustration purpose only and actual products may vary. To verify the authenticity of the product, you can provide samples for external visual inspection or conduct a comparison by decapsulation;

2. To protect the interests of our valued buyers, issues regarding labels will not be pointed out temporarily to prevent counterfeiters from becoming aware of the original label layout;

3. The label inspection service is provided on a voluntary basis, and clients assume all associated risks. Chuangxin Online Testing Center bears no responsibility for any consequences or legal liabilities arising from this service.

Examples of Label Inspection:

External Visual Inspection

Description:

External visual inspection refers to the examination of the sample's surface, silk screening/screen printing, packaging, and dimensions to determine if they comply with the specifications outlined in the specification document. It also verifies the oxidation and coplanarity of the pins.

Our Strengths: We utilize high-precision microscopes, have extensive testing experience, and provide efficient and expedient testing services.

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Image of External Visual Inspection Equipment:

X-Ray Inspection

Description:

X-ray inspection is a fast and effective non-destructive method used to analyze internal defects in samples. It utilizes high voltage impinging on a target to generate X-ray penetration to inspect electronic components, the internal structure of semiconductor packaging products, and the soldering quality of various types of SMT solder joints.

X-ray inspection primarily inspects the internal wafers, bonding wires, substrates, adhesives, and encapsulating materials of the chip. It can also detect various abnormal phenomena such as wafer cracks, voids in adhesives, die attach fillet, wire bonding radian, foreign objects in encapsulating materials, tilting and soldering of internal components in modules, ESD damage, etc. Customers can provide original samples or good chips for inspecting the consistency of the internal chip.

Our Strengths: We employ high-precision equipment, offer fast turnaround times, and possess extensive testing experience.

Images of X-Ray Inspection:

Image of X-Ray Inspection Equipment:

Functional Testing (FT)

Description:

Functional testing refers to conducting various necessary logic or signal status tests on a device under specific operating conditions (i.e., the normal use of the device environment, typically at room temperature) while it is functioning properly. This test is based on the original factory specifications as well as industry standards or regulations. Feasible test vectors or specialized test circuits are designed to apply corresponding signal source inputs to the test samples. By the adjustment and control of the peripheral circuits, signal amplification or conversion matching and other specific conditions, the logic relationship of the signals and the changing waveform of the output are analyzed to measure the functional characteristics of the device.

Our Strengths: Chuangxin Testing holds over a hundred patents and software copyrights, has conducted thousands of testing and development projects, and boasts a professional team capable of rapidly customizing development solutions to meet client needs.

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Acetone Test

Description:

Acetone testing involves the systematic wiping of the screen printing on the front surface of a chip using a certain concentration of acetone. The results are used to determine whether the surface of the chip has been reprinted. If the testing cotton swab turns black, it indicates a test failure.

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Scratch Test

Description:

According to the requirements of the test standard, sharp tools are used to scrape the surface of the chip back and forth to check whether there are any signs other than those present before testing. This scratch testing is supplemented by an external visual inspection to determine if the chip identification has been refurbished.

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Heated Chemical Testing (HCT)

Description:

Heated Chemical Testing (HCT) refers to subjecting chips to chemical reagents heated to a certain temperature. This process corrodes the coatings on the chip surface to verify if there are any indications of scratches, coating, or re-typing issues. The test fails if the test swab turns black.

Scope of Application:

Typically, it is accompanied by an external visual inspection to verify that refurbished products are ruled out.

Images of Heated Chemical Testing (HCT):

Decapsulation/Delid Test

Description:

Decapsulation, also known as decap or delid, is a destructive experiment that removes the outer encapsulation of the chip using chemical reagents or laser etching. It is used to inspect the original manufacturer's markings, circuit layout, process defects, etc., on the surface of the internal grains. Decapsulation is a significant means of counterfeit detection and can determine the authenticity and integrity of the chip.

Our Strengths: We have a vast original product database, enabling quick identification of genuine and counterfeit goods. We offer various methods of decapsulation, ensuring the successful decapping of special packaging materials.

Images of Decapsulation Test:

Image of Decapsulation Testing Equipment: